FINEPLACER® matrix ma - Semi-automatic Die Bonder

The FINEPLACER® matrix ma is a semi-automatic bonder providing a stable, high accuracy solution for a broad range of component and substrate sizes, and a bonding area up to 300mm. The platform  combines application modularity within an open hardware and software environment. Supporting a virtually unlimited field of applications including flip chip bonding, photonics and wafer level packaging, this system uses numerous die bonding technologies which ensures compatibility with future technologies as users transition from R&D into production.